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Upcoming Events:


NOTICE:

2015 IEEE Symposium on EMC&SI, March 15-21

Deadlines for Technical Submission are upcoming.



Date: Tuesday, January 13, 2015

5:30pm: Networking/light dinner
6:30pm: Presentation
7:45pm: Adjourn

Water and soft drinks are free. Light dinner is available for a small fee.

Location: Agilent Technologies

Title

Smart Grid EMC Standards Harmonization

Speaker

Jerry Ramie, ARC Technical Resources

Abstract

This Presentation describes how the SGIP (Smart Grid Interoperability Panel), under NIST, started work on identifying "gaps" in US immunity testing Standards for smart grid communications networking equipment. The five testing gaps were reported in their SGIP-EMI Issues white paper and used as input for the extension of IEEE-1613(2009), which covered immunity testing of protective relays under the IEEE Power & Energy Society.This extension, IEEE-1613.1(2013), currently covers all utility networking and communications equipment, including protective relays and smart-meter communications cards. It now harmonizes closely to what is required under the IEC. It is now being expanded in scope to include almost all utility-owned smart grid equipment.(including non-communicating autonomous devices) These five "gap" immunity tests and other features in this new Standard extension are discussed.

Biography

Jerry Ramie

Jerry Ramie is a 33-year veteran of the EMC test and measurement equipment business. He is Secretary of the ANSI-ASC-C63 Committee on EMC, a Member of the American Radio Relay League EMC Committee, a 2011 Distinguished Lecturer for the IEEE EMC Society on Smart Grid, a Member of the SGIP2-EMI Issues Working Group, the Vice-Chair of the IEEE Power and Energy Society Substations C2 Working Group, a duo-decade Member of The dB Society, an iNARTE-certified EMC technician and a Senior Member of the IEEE.


Date: Tuesday, February 10, 2015

5:30pm: Networking/light dinner
6:30pm: Presentation
7:45pm: Adjourn

Water and soft drinks are free. Light dinner is available for a small fee.

Location: Agilent Technologies

Title

Electrical Design for High-End Computer Systems

Speaker

Dale Becker, IBM

Abstract

The electrical design of computer systems includes signal integrity, power integrity, electromagnetic emissions and susceptibility and ESD. Practicing engineers in system design and development typically are skilled more deeply in one of these areas than the others. However, these are not independent disciplines and today's dense packaging and high-speed signals require more cross-discipline skills that we call co-design and co-analysis. This presentation comes from the perspective of an engineer most deeply skilled in the power integrity discipline and explores the building of cross-discipline skills focusing on the application of electromagnetic extraction and circuit simulation tools to electrical modeling that enables co-design for robust system development.

Biography

Dale Becker

Dale Becker received the B.E.E degree from the University of Minnesota, M.S.E.E. from Syracuse University and the Ph.D. from the University of Illinois at Urbana Champaign. He is the Chief Engineer of Electronic Packaging in IBM Systems and Technology Group and a member of the IBM Academy of Technology. His responsibility is the electrical system architecture of POWER and System z servers including the design of high-speed channels to enable the computer system performance and the power distribution networks for reliable operation of the integrated circuits that make up the processor subsystem.

Dr. Becker has been the General Chair of the IEEE EPEPS 2014 Conference and co-chair of the 2014 IEEE EMCS embedded conference on SIPI TPC. He has 25 patents on electrical design of computer systems and has presented 75 papers in refereed journals and international conferences covering many aspects of electrical computer system design including power distribution analysis and design and modeling of signal and power distribution networks. He is an IEEE Fellow, an iNEMI Technical Committee member and a member of IMAPS and SWE.